Upscaling of new solderplating process for PCSB
|Coordinator||PK PLATING TECHNOLOGY AB|
|Funding from Vinnova||SEK 900 000|
|Project duration||November 2014 - August 2015|
|Venture||The strategic innovation programme Electronic Components and Systems:|
|Call||Strategic Innovation Program Electronic Components and Systems - call autumn 2014|
Purpose and goal
The purpose for the activities within the Project, has been to verify and to scale up a new solderplatingprocess for sequential plating of PCSB with tin-silver-tin. The objective has been fulfilled, by running experiments both in lab scale and in a pilot-line. Critical process parameters has been identified. Suitable control methodes has been developed. A model for scaling up the plating process, for plating of PCSB with a diameter of 700 µm, has been verified.
Results and expected effects
Ionetching of plated balls, showed a silver content of 4 weight-%, in the solder, both in lab scale and in pilot line. Melting temperature, measured by DSC, showed 222 C for all samples. This is in accordance with expected and wanted values. The layers were even and non-porous. Soldering tests gave good results. The most critical parameter is the rotation of the balls within the barrel under plating in the tin bath. Parameter settings, tested in labscale, showed to be transformable for upscaling for plating in pilot line.
Approach and implementation
Sequential electrolytic plating of tin-silver-tin on solder balls, has been performed in labscale and in a pilot line. During the plating , the balls were placed in a barrel, with a fine mesh. The barrel was slowly rotated under the plating process. Bath liquid was pumped into the barrel during plating. Results has been verified by soldering tests, x-ray, microsectioning, ion etching and DSC-runnings.