Ultra-compact AESA Technology for Autonomous Aircraft

Purpose and goal

The aim of the project was to develop a compact, high-performance frontend for AESA technology, focusing on semiconductor materials, compact microwave packaging, and thermal management of these compact modules. The project has driven research in all of these areas. LiU has succeeded in tailoring semiconductor materials with a desired structure. Chalmers utilized these materials and processed transistors with satisfying results. A developed multi-layer process method enables a compact design, and a thermal sensor provides response to temperature in the core of the circuit.

Expected results and effects

The project´s innovations strengthen the aerospace industry by developing processes to be able to manufacture compact and high-performance microwave modules in Sweden. These modules have areas of application for all types of products where weight and size are extremely important, for example for UAVs or fighter aircraft. Another important effect is the expanded collaboration between universities and industry. This secures the Swedish excellence in semiconductors and integrated circuits.

Planned approach and implementation

The project has been carried out in collaboration between industry and universities. LiU has handled the manufacturing and optimization of GaN epitaxies, with input from Chalmers. Chalmers has contributed with research into transistors and compact packaging methods, but also with fabrication of circuits. Saab has been responsible for design and evaluation of circuits, but also the administrative parts such as requirements and project management. In order to follow up on the progress of the project, quarterly follow-up meetings have been held.