THz systems 2025

Reference number
Coordinator Omnisys Instruments Aktiebolag - Omnisys Instruments AB
Funding from Vinnova SEK 200 000
Project duration November 2018 - February 2019
Status Completed
Venture The strategic innovation programme Electronic Components and Systems:
Call Electronic Components and Systems. Research and innovation feasibility studies 2018.

Purpose and goal

Cost-efficient building practice and production of THz-diode components and systems is key for enabling applications outside the traditional scientific markets such as for the creation of improved systems for weather forecasting, security cameras and THz sensor electronics for monitoring of different types of industrial processes. It is also a prerequisite for maintaining the technological and competitive edge at already developed markets e.g. instrumentation for radioastronomy, climate research and weather satellites.

Expected results and effects

New building practice for THz systems involves both specialized circuit topologies, manufacturing processes and system integration, as well as new interfaces with support electronics and mechanical structures. Moreover a review of the complete manufacturing chain from semiconductor process to complete system is needed, in order to take the necessary steps towards full scale wafer production, fully automated on-wafer testing, and harmonization of circuit topologies and reliability testprograms, that are required for cost-efficient volume production of THz electronics.

Planned approach and implementation

The project consists of two parts, one general system pre-study and a second part which deals specifically with the implementation of key components and interfaces. In the general part the requirements for some different applications are reviewed, after which the requirements for future weather cube satellite networks are examined more in detail. In the second part aspects around 2.5-D packaging and production processes have been investigated and in some cases implemented in real radiometer hardware as part of ongoing development contracts.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 26 October 2018

Reference number 2018-03474

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