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Through-glass-via substrates enabling future RF products A feasibility study

Reference number
Coordinator Silex Microsystems AB
Funding from Vinnova SEK 995 000
Project duration November 2014 - February 2016
Status Completed
Venture The strategic innovation programme Electronic Components and Systems:

Purpose and goal

The pilot study has demonstrated the possibility of a new integrated - Through glass Via technology (TGV), with very low losses. The project aims of: 1 ) Developing a new RF TGV technology in glass wafers with extremely low losses and non-linearity effects, with 5x better performance than today´s commercial MEMS Via technology in the freq range of 0.5-10GHz; 2 ) customized test prototypes design to be verified in RF measurements in KTH RF lab are reached. The results will be used for commercialization of the technology.

Results and expected effects

This project has generated deep knowledge about new innovative TGV technology in the glass for Wafer level cost effective packaging, which will take the Swedish MEMS-based RF applications a big step forward. Our work will continue after this project, focusing on fully functional commercial RF - MEMS glass technology at TRL 8-9 for volume production on 8´ by 2018.

Approach and implementation

Two world -class partners with a unique set of complementary skills in: i) MEMS manufacturing. & 3D MEMS WLP technologies ( Silex ) and expertise in ii) modeling, design and testing of RF MEMS ( KTH MST) have worked together on this pre-study project to improve the Swedish value chain in the field of advanced 3D RF MEMS. A new advanced RF measurement setup has been established at KTH to study 2nd and 3rd order non-linearity RF effects.

External links

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 25 November 2019

Reference number 2014-05240

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