Through-glass-via substrates enabling future RF products A feasibility study
| Reference number | |
| Coordinator | Silex Microsystems AB |
| Funding from Vinnova | SEK 995 000 |
| Project duration | November 2014 - February 2016 |
| Status | Completed |
| Venture | The strategic innovation programme Electronic Components and Systems: |
Purpose and goal
The pilot study has demonstrated the possibility of a new integrated - Through glass Via technology (TGV), with very low losses. The project aims of: 1 ) Developing a new RF TGV technology in glass wafers with extremely low losses and non-linearity effects, with 5x better performance than today´s commercial MEMS Via technology in the freq range of 0.5-10GHz; 2 ) customized test prototypes design to be verified in RF measurements in KTH RF lab are reached. The results will be used for commercialization of the technology.
Results and expected effects
This project has generated deep knowledge about new innovative TGV technology in the glass for Wafer level cost effective packaging, which will take the Swedish MEMS-based RF applications a big step forward. Our work will continue after this project, focusing on fully functional commercial RF - MEMS glass technology at TRL 8-9 for volume production on 8´ by 2018.
Approach and implementation
Two world -class partners with a unique set of complementary skills in: i) MEMS manufacturing. & 3D MEMS WLP technologies ( Silex ) and expertise in ii) modeling, design and testing of RF MEMS ( KTH MST) have worked together on this pre-study project to improve the Swedish value chain in the field of advanced 3D RF MEMS. A new advanced RF measurement setup has been established at KTH to study 2nd and 3rd order non-linearity RF effects.