Your browser doesn't support javascript. This means that the content or functionality of our website will be limited or unavailable. If you need more information about Vinnova, please contact us.

Optoelectronics Packaging

Reference number
Coordinator CHALMERS TEKNISKA HÖGSKOLA AKTIEBOLAG - Chalmers tekniska högskola
Funding from Vinnova SEK 1 400 000
Project duration September 2008 - March 2012
Status Completed

Important results from the project

The purpose of this study is to examine the degree of automation in current optoelectronics production, in order to improve yields and reduce cost.

Expected long term effects

This project may result in novel ideas and principles for packaging and manufacturing optoelectronic modules.

Approach and implementation

An assessment of the current packaging situation in optoelectronic products is first made. From this assessment, specific hurdles and difficulties are identified in the process flow. In a third step, some of these hurdles are addressed and, hopefully, eliminated.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 25 November 2019

Reference number 2008-01000