Your browser doesn't support javascript. This means that the content or functionality of our website will be limited or unavailable. If you need more information about Vinnova, please contact us.

Integrated WLAN-PAs in 28 nm bulk and FD-SOI CMOS

Reference number
Coordinator Linköpings universitet - Institutionen för systemteknik
Funding from Vinnova SEK 240 000
Project duration November 2015 - February 2016
Status Completed
Venture The strategic innovation programme Electronic Components and Systems:

Important results from the project

The aim has been to evaluate and compare integrated power amplifiers for the new 802.11ac WLAN standard, with high linearity requirements in conventional 28 nm bulk (Catena) and components in 28 nm FD SOI (LIU) CMOS processes. We have reached all goals, except for the FD-SOI components that are not yet fully evaluated. However, we have been able to make a technology comparison for the partner company based on available data and also seen the difficulties of construction in the FD-SOI processes. A study of reliability has also been performed with good results and better understanding.

Expected long term effects

The project shows that it is possible to meet linearity requirements for 802.11ac WLAN power amplifiers in 28 nm CMOS but the performance needs improvement (higher linear output power, efficiency) to achieve a successful product. Catena now wants to proceed with a complete circuit design, and with the support of one additional partner, the application was filed 2016-03-04. The project has also led to publishing results: one accepted conference papers and materials for another.

Approach and implementation

The project has involved two partners: Catena Wireless Electronics AB, Kista, and Linköping University, coordinated by adj. prof. Ted Johansson. Design and implementation has worked well. Chips have been measured by both parties. Other work has been done through meetings in Kista and email communications. The roles have been clear, with Catena´s long experience in IC design of wireless products and customer requirements, and LiUs academic expertise on new technologies, component understanding but also circuit design.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 25 November 2019

Reference number 2015-04537