E!12884 eSecurePack Thin Film Electronics
|Coordinator||Thin Film Electronics AB|
|Funding from Vinnova||SEK 86 112|
|Project duration||February 2019 - May 2019|
Purpose and goal
The objective of the project was to develop a technology platform for smart packages built on conducting traces connected to a printed chip tag. The chip detects securely if the package has been opened, through sensing of the trace conductances, and communicates the open status to a user. We initiated the analysis of which materials to use for the printing process and which chips to use. We also started working on the integration of the chip to the package.
Expected results and effects
The objective of the project was to develop a technology platform for smart packages built on conducting traces connected to a printed chip tag. We started mapping which chips to use in order to identify the most suitable chip. We also started investigating the limitations of each chip. We also started to investigate how to integrate the chips to the packages.
Planned approach and implementation
The project setup was very efficient with technology development by Thin Film and printing process development by Jones Packaging. These two paths complement each other nicely. Unfortunately, it was not possible to finalize the project since the Swedish part of Thin Film Electronics will be shut down.