Processes for MEMS by Inkjet Enhanced Technologies
| Reference number | |
| Coordinator | KUNGLIGA TEKNISKA HÖGSKOLAN - Skolan för elektro- och systemteknik |
| Funding from Vinnova | SEK 2 340 000 |
| Project duration | March 2013 - June 2016 |
| Status | Completed |
Purpose and goal
The purpose of this project was to investigate the benefits by using mask-less, digitally controlled, selective additive processes instead of the subtractive processes, which are currently in use in MEMS manufacturing. The goal of fabricating 14 different demonstrators by using these new novel additive manufacturing methods was achieved. The focus, to do the MEMS processing more flexible and cost efficient has contributed to a more substantial competitive edge to the European MEMS industry.
Expected results and effects
As a part of the demonstrators related to ´Low cost methods for via fill and 3D integration´, KTH demonstrated together with Silex novel TSV and TGV concepts, by using digital methods. As a summary, most of the far-reaching targets and demonstrators were achieved, and a considerable part of the results is applicable in commercial production while some results are even more ground-breaking achievements.
Planned approach and implementation
As leader of Task 2.2/2.3, KTH has coordinated the work on TSV and TGV manufacturing using additive methods based on integration of bulk wire materials. Both well-established technologies (wire bonding) and novel approaches (magnetic assembly) have been successfully used. Together with the partners within the consortium, all key technologies were demonstrated and benchmarked with respect to performance and cost.