Chip scale micro liquid cooling for high dissipative packaging
|Coordinator||APR TECHNOLOGIES AB|
|Funding from Vinnova||SEK 300 000|
|Project duration||December 2018 - May 2019|
|Venture||The strategic innovation programme for graphene|
Purpose and goal
There is today a market need for more efficient cooling of heat-dissipating electronics. Traditional solutions exist, but all of them are either limited or demanding and expensive. APR Technologies has a revolutionary idea of using miniature pumps and dielectric fluid to cool electronics directly at the chip level, thus achieving enhanced design freedom, performance, and lower manufacturing costs. A success factor is to enhance the heat transfer between chip and refrigerant with two-dimensional layers (graphene and/or BN-based).
Expected results and effects
Space applications are e. g. earth observation, scientific missions, telecommunication and navigation. In aviation applications are radar, computer power, graphics processing and artificial intelligence/AI etc. Potential customers are Thales, Airbus, NASA, Boeing and SAAB. In addition to the above applications, with high prices but limited volume, there are volume applications, such as smartphones, tablets, laptop computers, etc. Potential customers are Samsung, Apple, Lenovo etc. Not at least in the case of fast charging, you need the maximum cooling capacity to small size.
Planned approach and implementation
This project involves an overall feasibility study comparing both established and new technologies to find one or more winning concepts. These will form the basis of an intended R&D or Demonstrator project. In this project, APR, CIT and Chalmers collaborate. Two external companies with interest in the technology will also follow the project.