Chip scale micro liquid cooling for high dissipative packaging

Reference number 2018-03306
Coordinator APR TECHNOLOGIES AB
Funding from Vinnova SEK 300 000
Project duration December 2018 - May 2019
Status Ongoing
Venture The strategic innovation programme for graphene
Call SIO Grafen: Samverkan för kommersiella tillämpningar med grafen - hösten 2018

Purpose and goal

There is today a market need for more efficient cooling of heat-dissipating electronics. Traditional solutions exist, but all of them are either limited or demanding and expensive. APR Technologies has a revolutionary idea of using miniature pumps and dielectric fluid to cool electronics directly at the chip level, thus achieving enhanced design freedom, performance, and lower manufacturing costs. A success factor is to enhance the heat transfer between chip and refrigerant with two-dimensional layers (graphene and/or BN-based).

Expected results and effects

Space applications are e. g. earth observation, scientific missions, telecommunication and navigation. In aviation applications are radar, computer power, graphics processing and artificial intelligence/AI etc. Potential customers are Thales, Airbus, NASA, Boeing and SAAB. In addition to the above applications, with high prices but limited volume, there are volume applications, such as smartphones, tablets, laptop computers, etc. Potential customers are Samsung, Apple, Lenovo etc. Not at least in the case of fast charging, you need the maximum cooling capacity to small size.

Planned approach and implementation

This project involves an overall feasibility study comparing both established and new technologies to find one or more winning concepts. These will form the basis of an intended R&D or Demonstrator project. In this project, APR, CIT and Chalmers collaborate. Two external companies with interest in the technology will also follow the project.

The project description has been provided by the project members themselves and the text has not been examined by our editors.