On-chip UWB Smart Antenna Array at mm-Wave with New Capped Bowtie for 5G Communication System and Future Smart Systems

Reference number
Coordinator CHALMERS TEKNISKA HÖGSKOLA AKTIEBOLAG - Department of Signals and Systems
Funding from Vinnova SEK 204 136
Project duration November 2016 - March 2017
Status Completed
Venture The strategic innovation programme Electronic Components and Systems:
Call Electronic Components and Systems. Pre-studies 2016.

Purpose and goal

The purpose of this project is to preliminarily developing a new multilayer mm-Wave UWB smart capped Bowtie array antenna so PCB or on-chip technology can be applied for mass production. Our goals are preliminarily establishing the working principle, making a few simulation models of small arrays covering different UWBs to prove the feasibility and flexibility of this technology, experimentally verifying the integration solution, and therefore to provide a solid platform for full development of this technology in the full project. We have fulfilled 90% goals at the project closing.

Expected results and effects

The most important results from this project are establishment of the working principle of the capped Bowtie antenna, simulation verification of the feasibility and the flexibility of the multilayer geometry, PCB/silicon based manufacturing consideration, and measurement verification of the system integration of the array with DSP platform. With these results, the full development of this technology will not have fundamental obstacles. This technology will offer a unique solution to mm-Wave systems in 5G, and have a very high potential to have commercial success in 5G market.

Planned approach and implementation

Designs of single element and 2x2 small array were done for the two sub-systems in 5G: access systems (20-50 GHz) and dual-band radio links (23 GHz band and E-band). The good results provides a solid platform for full development. On the system integration, due to the small size of antenna element, amplifiers with VCSEL (Vertical-Cavity Surface-Emitting Laser) will be used to transform the RF signals to optical signals and then apply six-core optical interconnect fibers to DSP (digital Signal Processing) platform. We have done a measurement test and proven the feasibility of this idea.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 25 November 2019

Reference number 2016-03935

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