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Novel precision measurement method for in situ detection of solder joint fatigue

Reference number
Funding from Vinnova SEK 400 000
Project duration October 2017 - March 2018
Status Completed
Venture The strategic innovation programme Electronic Components and Systems:
Call Electronic Components and System. Research and Innovation Projects. Studies 2017.

Purpose and goal

We have reached the goal, which is experimental validation of a new non-destructive, high-precision method for in situ detecting fatigue cracking in solder joints.

Expected results and effects

The validated method can be used as a time and cost efficient tool for developing wide bandgap electronics packaging solutions that can withstand higher temperature variation and gradients than traditional Si based constructions.

Planned approach and implementation

The realization of modules for the experimental validation of the method took longer time than planned. Therefore, the validation only became ready at the very end of the pre-study. For this reason we were not able to make a full project application with a extended consortium for the call in March 2018.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 25 November 2019

Reference number 2017-03546

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