Novel precision measurement method for in situ detection of solder joint fatigue
|Coordinator||RISE RESEARCH INSTITUTES OF SWEDEN AB - RISE RESEARCH INSTITUTES OF SWEDEN AB,Borås|
|Funding from Vinnova||SEK 400 000|
|Project duration||October 2017 - March 2018|
|Venture||The strategic innovation programme Electronic Components and Systems:|
Purpose and goal
We have reached the goal, which is experimental validation of a new non-destructive, high-precision method for in situ detecting fatigue cracking in solder joints.
Expected results and effects
The validated method can be used as a time and cost efficient tool for developing wide bandgap electronics packaging solutions that can withstand higher temperature variation and gradients than traditional Si based constructions.
Planned approach and implementation
The realization of modules for the experimental validation of the method took longer time than planned. Therefore, the validation only became ready at the very end of the pre-study. For this reason we were not able to make a full project application with a extended consortium for the call in March 2018.