Demonstration of energy efficient SiC power module with low inductance
|Coordinator||ASENSOR TECHNOLOGY AB|
|Funding from Vinnova||SEK 400 000|
|Project duration||November 2018 - March 2020|
|Venture||The strategic innovation programme Electronic Components and Systems:|
|Call||Electronic Components and Systems. Research and innovation feasibility studies 2018.|
Purpose and goal
The purpose of this project is to demonstrate a new way to assemble SiC power modules with considerably lower built-in inductance, higher work frequency and higher energy density than standard modules. The aim is to demonstrate a cost effective power module assembly that includes SiC-semiconductors and critical capacitances. The concept is compatible with standard microelectronic production modules, materials and processes so that the price can be kept on an acceptable level.
Expected results and effects
We expect to be able to demonstrate an assembly method for power modules where we can achieve a higher switch frequency maintaining or even improving energy efficiency. This will allow for size reduction of passive components like transformers and filters, thereby reducing the system price even though SiC component price and energy density is higher. After project end, we expect to have the basis for a continued development of this power module assembly method.
Planned approach and implementation
Nov-Dec 2018: GE specifies the requirements that the demonstrator module shall be designed and evaluated after. Requirements shall be connected to a potential commercial application. Asensor Technology will work with detailed design and simulation of the demonstrator module, connection layout, wire bond diagrams and other manufacturing basis and will also purchase materials and components. KTH prepares test set-up. Jan-Mar 2019: Demonstrator modules will be built by Asensor Technology; KTH and GE will perform measurements and evaluation. Reporting during March 2019