A Novel Multi-Industrial Nano Control Unit based on Thermal Imaging
|Coordinator||RISE Research Institutes of Sweden AB - Rise Acreo, Kista|
|Funding from Vinnova||SEK 2 000 000|
|Project duration||May 2016 - August 2019|
Purpose and goal
The goal of the project was to research and develop, a novel Multi-Industrial Nano Control Unit based on thermal imaging, "MINC". The aim of the project was to develop an innovative low-cost, uncooled thermal camera sensor to be offered in the consumer market and towards the automotive industry. Within the project, RISE Acreo have developed hermetic wafer scale bonding methods. Appropriate anti-reflective surface treatment (ARC) and getter materials have been selected.
Expected results and effects
We have developed and tested two different hermetic wafer level packaging processes (eutectic and thermocompression) within the project that show promising result for a robust packaging concept. The packaging processes work for low temperature bonding (below 400 °C) and are cost-effective. Simulation for anti-reflective coating (ARC) shows that the selected material can produce the desired effect together with bonding methods and we have been in contact with companies that supply getter material in an industrial scale.
Planned approach and implementation
Each partner in the project has contributed with their key competence and developed their technology within the project. Technology transfer has taken place at certain milestones within the course of the project. Within the project, read-out electronics, detector materials, wafer level packaging technology and evaluation boards have been developed. Communication between project partners has taken place mainly via skype and mail.