3D HapticTouch ASIC --- ASIC integration for smart 3D imaging sensor system for ultrasonic sensor for gesture control
| Reference number | |
| Coordinator | Myvox AB |
| Funding from Vinnova | SEK 3 990 000 |
| Project duration | July 2018 - November 2020 |
| Status | Completed |
| Venture | The strategic innovation programme Electronic Components and Systems: |
Purpose and goal
The project 3D HapticTouch ASIC has developed a prototype of a technic (a chip) that will be placed in machines for different industrial applications. The company have with the work on the project achieved core technology, which means a functional prototype is available for use.
Expected results and effects
The project has accomplished several prototypes during the project phases. Which the last version of the prototype with actuation of 1600 pMUT loudspeakers for application with in pick and place machines in collaboration with Mycronic, a leading Swedish pick and place machine manufacturer. The project has also contributed to educating two new mast of engineering students to accomplish their degree by doing their master thesis with in the project. The project have also employed a new graduated PHD student from Chalmers university of technology.
Planned approach and implementation
The project started with consists of 8 work packages aimed at developing the two generation of ASIC components and integration with MyVox existing and coming generation pMUT MEMS chips. During the project the complexity of a Rx system caused a barrier which made the project focus to shift from Rx/Tx to only Tx-beamforming with the aim of both haptic feedback as well as pick and place ability. The Rx system will be achieved by an external camera or similar solution. The 8 WP was carried out but only with different content.