Optimization of power PCB design with integration of SiC Power Components

Purpose and goal

The goal for the project was to make the introduction of SiC power components easier through a new, optimized power board design for induction heater applications. The optimization has been achieved through a systematic comparison of electrical and thermal parameters at different board and cooling designs. This resulted in a modular board solution. A detailed board layout has been made and it has been determined that air cooling will be sufficient and the liquid cooling of today can be eliminated. This makes the SiC introduction more attractive.

Results and expected effects

The project resulted in a modul based power board solution using SiC transistors easily modifiable to desired power levels for different product variants. The chosen SiC components have several manufacturers making productification of the power board easier. The proposed solution makes introduction of SiC easier and that will in future result in significant energy savings and less CO2 pollution.

Approach and implementation

The project was started with a literature study of power board solution for induction heaters. Than a systematic analysis was carried out of available components and the thermal and electrical parameters at different board solutions were compared. The result of the analysis was a modular board design with TO packaged SiC components. A detailed board layout followed. It has been shown that only air cooling will be sufficient in the new solution.