Measurement method for thermal transport properties of nano structures
Reference number | |
Coordinator | Hot Disk AB |
Funding from Vinnova | SEK 1 356 000 |
Project duration | November 2014 - June 2016 |
Status | Completed |
Important results from the project
The aim is to develop a method for measuring the thermal transport properties with an accuracy better than 3% in a homogenous or multi-layered structure with a total thickness < 10 microns, which is of great interest especially in micro- and nanotechnology. With a microwave-adapted strip sensor and measuring bridge, and developed calibration routine, the method works for materials with thermal conductivity < 20 W/mK, which covers most of the multi-layered structures. In order to handle higher-conducting materials, a further refinement of the calibration routine is needed.
Expected long term effects
The goal is for Hot Disk AB to be able to offer customers particularly in the semiconductor industry an instrument based on this method. The commercialization phase is divided into three parts, during phase 1 (-2016) and 2 (2017) a measurement facility is to be established at Chalmers respective retailers in the US, Germany and possibly Taiwan. During phase 3 (2018-) launch of instrument takes place. Annual sales of 5-10 instruments is estimated, with a selling price of around 1 MSEK to end customer.
Approach and implementation
The project has been interdisciplinary, requiring expertise in microfabrication, microwave technology, and theoretical models for heat transport. Qualified staff from the Nanofabrication Laboratory, Chalmers and Technical Research Institute of Sweden, Borås, have been employed in this project.