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Swedish collaboration with Korea, Japan and Taiwan in semiconductors

Reference number
Coordinator RISE Research Institutes of Sweden AB
Funding from Vinnova SEK 300 000
Project duration November 2023 - June 2024
Status Completed
Venture 2023-00007-en

Important results from the project

The purpose of the report is to provide an overview of existing and possible innovation collaborations in the semiconductor field between Sweden and South Korea, Japan, and Taiwan. The report serves as a basis for priorities and initiatives from Vinnova and other Swedish actors in the semiconductor field. The report highlights the importance of the semiconductor area and shows the enormous investments being made in the world, while at the same time clarifying the countries´ movements in the area. The report then formulates recommendations for Sweden in the semiconductor field.

Expected long term effects

The report makes 18 semiconductor recommendations for Sweden in the following areas 1. Cooperation with Asia 2. Semiconductor intentions for Sweden 3. Areas for investment 4. Management of the Chips Act 5. General recommendations Implementation of the recommendations would mean a clear positioning for Sweden in the semiconductor area and a unified way forward.

Approach and implementation

The project has been conducted by RISE with support from Vinnova, which also conducted interviews. The Research and Innovation Councils in South Korea and Japan have analyzed the situation in each country and written reports on it. In addition, a large number of reports have served as a basis, and our own experiences have also been incorporated. In total, 14 in-depth interviews were conducted in the project. Four reference group meetings have been held, and the project has compiled a report that was submitted to the reference group for feedback, after which the final report was compiled.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 3 July 2024

Reference number 2023-03976