Sillicon Qubit Microsystems in a Cryo-optimized Package

Purpose and goal

The project aims to develop a fully packaged silicon-based quantum dot spin qubit integrated circuits to answer the needs for future chip manufacturing for quantum computing. The goal is to especially develop fully scalable cryo-microsystem technology system consisting of silicon quantum dot qubit chip in a unique packaging. Our approach provides a user-friendly, potentially plug-and-play, scalable, sustainable and cost-effective solution to the scalable hardware problem.

Expected effects and result

The solution forms a unique, stand-alone silicon spin qubit quantum processing unit (QPU) that is user-friendly, potentially plug-and-play, sustainable, cost effective and also accessible to and usable for non-experts. This innovative approach leverages advanced semiconductor processes, providing compatibility with existing fabrication technology and scalability for future expansion.

Planned approach and implementation

Quantum and cryo hardware and microsystems require highly specialized knowledge and facilities. By combining the international resources of this consortium over a broad value chain, our collaboration can push the boundaries of current research. Each party in the project will be responsible for a particular investigation and development all while there is an active alignment function work package to reassure that the finish solution is perfectly compatible.