High performance packaging technology for 5G and future mobile communication

Purpose and goal

The aim is to investigate a new type of copper/graphene composite with outstanding thermal property. Our goal is to achieve graphene/copper composite layered structures between 800 to 1000 W/m K leading to enlarged capacity for improvement in electronics system. The research results show that we can achieve 495W/mK for the graphene enhanced copper composite and 672 W/mK for the graphene copper laminates. It indicates clearly that this is an interesting candidate as heat spreader that can potentially be used in the printed circuit board (PCB) in electronics systems.

Expected results and effects

We achieved up to 84% of the thermal conductivity as set by the project goal, which can be considered to be a very interesting material for further study. The projects fulfills the goals of developing new packaging technologies by using a new packaging substrate for better heat dissipation in 5G and other high-power electronics applications. The project involved industry as an end user and application specification provider, research institute and academy. It was the first time that the graphene and copper composite/laminate was developed as a potential material for heat spreading.

Planned approach and implementation

To prepare the graphene/copper composite bulk, graphene oxide was coated on copper powder by mechanical stirring. Then, the graphene oxide was subjected to chemical reduction. Finally, the powders were packed for further sintering process. The prepared bulk sample was characterized by SEM, Raman spectroscopy and Laser flash method. The graphene and Cu laminated film was prepared by electroplating. The prepared laminate was characterized by SEM, XRD pattern, X-ray radiography, and IR camera. SEM and XRD indicate a tight and densified bonding between graphene and copper.