Exploring Collaboration on Low Dimensional Flexible Silicon Based Semiconducting Films and Fibers

Purpose and goal

In this project, we would like to deepen our contact with our Singapore partners, hoping to be able to conceptualize our collaboration ideas and initiate activities that can lead to future projects. We would like to develop ideas of producing anisotropic semiconducting films together with them, which can be used further to make other functional devices such as diode. We would like to concretize the ideas of integrating semiconducting fibers with printed electronics, in order to unleash the potential of the novel Si fibers.

Expected effects and result

Deepen contact with our Singapore collaborators. Develop the idea of flexible Si membrane with adhesive matrix. If our hypothesis for anisotropic semiconducting films works, then we will be able to fabricate flexible diodes in a totally new manner, and the diodes will also be more reliable and robust. The implications will be significant with a positive testing result. Concretize possibilities to integrate Si fibers to printed electronics We foresee novel optoelectronic sensing functions to be realized in this this hybrid flexible constellation.

Planned approach and implementation

1. Technology mapping of adhesive film technology and particle implementation methodology. Investigate the possibility to develop anisotropic semiconducting tape together with 3T-Frontier. The methods and processes to realize Schottky contact between Si and Al will be defined. 2. Technology mapping considering: where do semiconducting fibers and printed electronics meet what are the desired applications. Investigate the possibility to integrate the Si fibers with printed electronics. Investigate the possibility to use Al laminates as a greener alternative than printed Ag.