Low-Thermal-Conductance and High-Density Microwave Interconnects for Cryogenic Quantum Computers
| Reference number | |
| Coordinator | SCALINQ AB |
| Funding from Vinnova | SEK 1 992 279 |
| Project duration | May 2024 - December 2025 |
| Status | Completed |
| Venture | Banbrytande tekniklösningar |
| Call | Groundbreaking and scalable technology solutions in 2024 |
Important results from the project
Expected long term effects
The project created a foundation for us to continue developing future large-scale QPU packaging.
Approach and implementation
The project was carried out in a number of workpackages, focusing on different aspects of the technical investigations, mechanical and electrical. The project was carried out by an interdisciplinary team.