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Low-Thermal-Conductance and High-Density Microwave Interconnects for Cryogenic Quantum Computers

Reference number
Coordinator SCALINQ AB
Funding from Vinnova SEK 1 992 279
Project duration May 2024 - December 2025
Status Completed
Venture Banbrytande tekniklösningar
Call Groundbreaking and scalable technology solutions in 2024

Important results from the project

The main objective was achieved. During the course of the project, some results led to changes in the plan and work packages. This also affected their initial, specific objective and timelines. The project also resulted in several discoveries that are critical to furthering the development of this concept.

Expected long term effects

The project created a foundation for us to continue developing future large-scale QPU packaging.

Approach and implementation

The project was carried out in a number of workpackages, focusing on different aspects of the technical investigations, mechanical and electrical. The project was carried out by an interdisciplinary team.

External links

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 4 February 2026

Reference number 2024-00508