High Resolution Pattern Metallization of Plastic Materials
| Reference number | |
| Coordinator | CUPTRONIC TECHNOLOGY AB |
| Funding from Vinnova | SEK 500 000 |
| Project duration | June 2015 - April 2016 |
| Status | Completed |
Purpose and goal
The objective with the HMP Project has been to verify a new Cuptronic technology through development of special resins with chemistry suitable for the Cuptronic technology and subsequent metal plating process steps. Demonstrators with metal patterns of different line width are produced. The developed resins has partly ´green chemistry´ origin.
Results and expected effects
The project has demonstrated that the HMP technology with newly developed Cuptronic chemistry fulfill the project objectives. Proof-of-concept has been demonstrated. Next step is continued development work to bring the technology into a commercial process and verify the results in commercial products. Collaborations with Swedish partners as sub contractors are established
Approach and implementation
Development of new resins, modified Cuptronic process for making patterns on diffferent substartes and metallisation of lines with different width has been performed in the HMP Project. Market and competitor analysis has been performed. IPR is filed.