EPAMO
| Reference number | |
| Coordinator | Silex Microsystems AB |
| Funding from Vinnova | SEK 2 604 060 |
| Project duration | April 2011 - March 2014 |
| Status | Completed |
Important results from the project
Optimization of the new TSV tech. for GHz range useable for RF MEMS / IPD applications developed & demonstrated up to 10 GHz (fullfilling mobile phone spec). New MEMS vaccum packaging technology on WL developed and verified. Comprehensive IPR and market analysis made about the possibilities with new TSV technology for new MEMS and RF applications. Established contacts with new int. customers and suppliers. New production equipment qualified for the project to solve the previous mfg. problem. Roadmap for ramping the results to volume production established.
Expected long term effects
New customer engagements established and RFQs from world-leading IC companies for new IPD and RF MEMS related to this Project. Target 2015: > 10 MSK turnover based on new technology from the project. Participated at 5 fairs / conferences. The results presented in invited article in MWJ journal distributed at MWC in Barcelona Feb´14. TSV with good RF characteristics demonstrated. Process integr. possible with magnetics for improved RF inductors (synergy effects with ended F&V project mag-MEMS). New SILEX IP in this TSV filed.
Approach and implementation
Silex has been WPL for IPD task and packaging of MEMS. Silex has participated as a board member and got insight into the whole project. The project faced some major delays (Tech. challenges outside the control of Silex). Change of tasks and responcibilities has happened several times. One partner went bankrupt in first 6 months and under year3 another partner in tight collaboration with Silex were acquired and the new owner did not want to continue the project Silex has on its own and together with some external partners outside the project had produced good results now being commercialized.