E2PackMan

Purpose and goal

E²PackMan aims to strengthen innovation and packaging production in Europe to improve the ecosystem for advanced electronics. Integration of more functionality in smaller volume, at the same or lower cost, is still the major driver and assembly and packaging (A&P) expertise is becoming of increasing importance. A&P in Europe needs design for excellence, equipment development, simulation techniques, material development and smart production with AI/ML and digital twin methodologies.

Expected effects and result

To secure electronic products "Made and Designed in Europe", the project will strengthen higher education, work force competence, innovation, production in the A&P sector, and materials research as well as innovative equipment, process, and manufacturing. This will catalyze industrial production capabilities in Europe, e.g. of semiconductor suppliers in Europe, and creating new open access opportunities, e.g. an infrastructure that enables SMEs to produce their innovative devices in Europe.

Planned approach and implementation

E²PackMan focuses on the three device categories Communication & Computing, Sensors, and Power Devices that are applied to the three strong European application fields “Mobility, “Energy” and “Digital Industry” where high reliability and long lifetime is required. A world-class consortium of 60 partners, representing the whole value chain from material, process and technology developments will push advanced packaging in Europe towards heterogeneous system integration.