Compact Low-Inductive SiC Power Module (Embedded Integrated 10 kW Power Module with SiC MOSFETs)

Important results from the project

The project has achieved all its objectives and generated valuable results. This was achieved regardless of forced departure of an important industrial partner (reorganisation at GE) and thus reduced budget, the need to find replacement, difficulties with external services (ribbon bonding) and chip assembly which caused delays.

Expected long term effects

A low inductive module with inductance <6.2 nh has been developed. low inductance conditions and construction based on dcb aln substrate with flex connections, ribbon bonding and 3d printed case have been verified. inmotion has evaluated the modules in the test rig. external gate drivers have been developed and tested by mid sweden university. the project has been presented in the wbg power center. the project rsults will be presented at ieee conference, 39th international electronic manufacturing technology conference (iemt2020) later this year and at scape conference in may 2021.>

Approach and implementation

The project has been carried out in coordination with the LIMS project financed by the Swedish Energy Agency. The projects have focused on two alternative layout concepts. RISE Acreo has been responsible for low inductive module design, IVF for module construction and Inmotion for module evaluation and tests, OnSemiconductor supplied MOSFET chips and Mid Sweden University developed gate drivers for modules. External services were employed for ribbon bonding of MOSFET chips and bond wire gate connections. Delays were caused by technical difficulties related to external services.