Chips JU 2024 RIA NexTArc

Purpose and goal

1. Increase the adaptation of AI in smart, sustainable and liveable neighbourhoods 2. Improve the connectivity preparedness of cyber-physical assets within the urban and industrial spaces 3. Design and implement cyber-physical security and trustworthy functionalities to extend the SoC and embedded architecters 4. Rigorously assess the system-level and Digital-Twin-compliant properties of applications 5. Allow open source solutions 6. Demonstrate through 3 use case sand 15 demonstrations

Expected effects and result

Improvement of the resilience, sustainability, liveability, connectivity, and integrity of urban and industrial spaces through smart and trustworthy services by delivering innovative solutions at i) Chip, devices and vehicle levels, ii) transportation and network levels, and iii) smart city, mobility and logistics level to improve the cyber-physical, socio-economic and climate resilience by designing and developing open-innovation supported High-Level Services- and System-in-the-loop

Planned approach and implementation

The project consists of 3 use cases that include 15 demonstrations. In addition, it includes 15 Key Innovations that will contribute to these 15 demonstrations. A number of tests will take place annually in connection with the review periods. The project is planned so that all national clusters contribute to several demonstrations. The main locations for the demonstrations are Stockholm, Istanbul, Madrid, Modena, Zurich.