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Chips JU 2024 IA NeAIxt

Reference number
Coordinator Kungliga Tekniska Högskolan - KTH Skolan för elektroteknik och datavetenskap, avdelningen för Elektronik och inbyggda system
Funding from Vinnova SEK 14 115 475
Project duration September 2025 - August 2028
Status Ongoing
Venture Chips JU

Purpose and goal

The NeAIxt consortium addresses challenges in next-generation Edge AI. The Swedish team develops energy-efficient custom solutions for object and situation recognition using IRnova’s infrared and mm-wave sensors, applied in health, safety, and industry with Strikersoft, FOI, and IRnova. Implementations run on KTH’s SiLago platform, ported to 22nm FDSOI for ASIC-like efficiency, benchmarked on COTS, and synthesized to IMEC’s 2nm node.

Expected effects and result

In NeAIxt, the Swedish consortium will deliver: FOI demonstrating neural-network object detection using IRnova’s advanced IR sensor; IRnova showcasing yield-improvement AI/ML and IR-based detection; Strikersoft enhancing search-and-rescue with mmWave and IR sensors; and KTH presenting its 22nm-ported SiLago framework for these demos, highlighting the potential benefits of a future 2nm port. KTH will also be able to show 10-100X improvement of SiLago designs to COTS implementation

Planned approach and implementation

Strikersoft, IRnova, and FOI will define quantifiable requirements for their AI/ML applications, prepare training and validation datasets, develop their algorithms, and implement and demonstrate them on COTS platforms such as FPGAs and GPUs. KTH will adapt the existing micro-architectural SiLago framework to the 22nm node, characterize and map partners’ AI/ML applications onto it, benchmark SiLago designs against COTS implementations, and synthesize SiLago for 2nm to evaluate potential benefits.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 15 September 2025

Reference number 2025-00893