Compact Phased Array Sensors and Communication Systems

Important results from the project

** Denna text är maskinöversatt ** The goal of the COMPASS project was to demonstrate the possibilities of making a highly integrated microwave module. This can be a very cost-effective and compact construction method that is very well suited for small AESA systems for flying platforms where size and weight are limited. To fulfill this, the encapsulation technology needs to have good microwave properties in order to be able to transmit high-frequency signals with low losses, as well as offer efficient cooling of the electronics.

Expected long term effects

** Denna text är maskinöversatt ** Through simulations and measurements, the project has shown very good microwave properties for the new enclosure technology. We therefore see no obstacles to making high-frequency AESA solutions based on this technology. In addition, the heat conduction properties of a cooling solution for the integrated semiconductor chips have been measured by a new method for measuring the thermal resistance of electronics inside a capsule. The results show very good cooling capacity, and no obstacles to further development.

Approach and implementation

** Denna text är maskinöversatt ** The project has included simulations, fabrication, and measurements of highly integrated microwave modules for AESA applications. Two manufacturing rounds have been used, with the first aimed at characterizing fundamental properties of the encapsulation technology, such as electromagnetic and thermal performance. With these basic features in place, a microwave module was produced in a second manufacturing round where integration of advanced semiconductor chips side-by-side with passive surface mount components could be demonstrated.