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Travel grant 2026 Switzerland, SWII 2026 on the 4th of February in Zurich

Reference number
Coordinator EMBEDL AB
Funding from Vinnova SEK 15 000
Project duration February 2026 - February 2026
Status Ongoing
Call Travel grant Vinnova 2026

Purpose and goal

Embedl is participating in SWII to engage organisations in robotics, automation, industrial systems, and other areas where embedded AI is critical. The event’s format enables efficient discussions to understand constraints, validate where Embedl’s products add value, and identify opportunities for commercial follow-up or applied R&D. Embedl also aims to connect with Nordic and DACH companies facing similar challenges in edge AI deployment, hardware diversity, and regulatory requirements.

Expected effects and result

Through participation in SWII 2026, Embedl expects to expand its network in the Nordic and DACH regions, identify potential customers for its products, and assess interest in future applied R&D collaboration opportunities. The Vinnova session is expected to clarify relevant funding instruments and potential next steps for future project applications.

Planned approach and implementation

During the one-day SWII event, Embedl will join structured one-to-one meetings, networking activities, and give a short elevator pitch presenting its offering and R&D interests. Embedl will also meet participating companies and join a Vinnova session on R&D funding. Informal discussions during breaks and lunch will provide additional opportunities to connect with partners and stakeholders.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 3 February 2026

Reference number 2026-00225