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Novel packaging technologies for highly integraded micromuldes for next generation telecon and automotive products (HiMICRO)
| Reference number | 2003-00129 |
| Coordinator | Ericsson AB - Microwave and High Speed Electronics Research Centre |
| Funding from Vinnova | SEK 2 370 000 |
| Project duration | January 2003 - June 2004 |
| Status | Completed |
Last updated 8 October 2021
Reference number 2003-00129
